For many years, Chen hsuan Technology/Xi Teng Precision has been focusing on the development of related products in the fields of optoelectronic semiconductors (mass production of Metal frames, Cassettes and Magazines), automation and machine vision (AOI), providing a variety of innovative technical services and "high quality + low cost + short delivery time" products, which have won high praise and long-term support from customers. With the rapid progress of automation, machine vision, AI and Industry 4.0 industries in the future, we will continue to invest in innovative research and development to provide various technical solutions and high value-added automation and machine vision key components to meet future challenges.
AOI (machine vision) light source design and manufacturing What are the lighting sources used in AOI and machine vision? In automatic optical inspection (AOI) and…
What is a Load Cell? What is a Load Cell?Load Cell is a sensor element that converts mechanical force (such as weight, pressure or tension)…
Application of carbon fiber in semiconductor precision equipment High-performance carbon fiber component solutions specifically designed for semiconductor manufacturingAs semiconductor manufacturing processes move toward nanometer levels,…
CHTCO is centered on a world-class precision die stamping and mechanical design team with highly professional and rich experience in Metal frame/Cassette/Magazine production and design,…
We serve customers in the global semiconductor industry and hope to become a solid innovation foundation for the semiconductor industry. This innovative foundation is backed by TSMC's diverse and comprehensive process options and services.
TSMC
ASE Group is the world's largest semiconductor manufacturing service company, and has long been providing global customers with the best services and most advanced technologies. Since its establishment in 1984, it has been committed to providing complete packaging and testing services to semiconductor customers, including integrated services from front-end chip testing and wafer probe testing to back-end packaging, materials and finished product testing.
ASE
