In semiconductor manufacturing, the Edge Sensor (ES) probe holder is a high-precision solution designed specifically for production testing. It combines a probe with a micro switch sensor, making it an ideal choice to replace traditional probe cards. This article will introduce the working principle, technical features, and application of the Edge Sensor probe seat in die (wafer) point measurement and Probe technology, so that engineers and industry experts can effectively improve test efficiency, reduce costs, and maintain test consistency.

1. Edge Sensor Probe Seat Technology Introduction

The Edge Sensor Probe Holder is an innovative solution designed specifically for production test, combining a probe with a micro switch sensor for wafer and die inspection requiring precise point measurement. Its design significantly reduces the cost of traditional probe cards while improving maintenance convenience.

1.1 Core Functions

Real-time edge detection: Detects position and displacement deviations of wafer or die edges.

Adjustable contact force: Through elastic adjustment, the contact force between the probe and the sample can be precisely controlled to ensure minimal needle marks and consistency.

Quick adjustment function: quickly adjust the contact force and point measurement position according to the grain size and test requirements.

1.2 Advantages and characteristics

Cost-effective: Replaces traditional probe cards which are expensive and difficult to maintain.

Optimized test solution: especially suitable for testing samples with less than 4 electrodes.

Easy maintenance: Simple structure design, convenient maintenance and adjustment.

2. Application of die (wafer) spot measurement technology

Die spot testing is an important step in the semiconductor manufacturing process. The Edge Sensor probe holder can perform high-precision functional and electrical characteristics testing.

2.1 Application Scenario

Functional testing: Verifies the current, voltage and signal integrity of the die.

Yield detection: Improve production yield and quickly identify abnormal grains.

Failure analysis: Detailed inspection and analysis of faulty die.

2.2 Improving test accuracy

The Edge Sensor probe holder can precisely adjust the contact force during testing, thereby reducing test needle marks and ensuring consistency of needle marks across the entire wafer, an advantage that is difficult to achieve with traditional probe cards.

3. Innovation and integration of Probe technology

Probe technology combined with the Edge Sensor probe holder can more effectively support high-speed and high-precision wafer inspection needs.

3.1 Technical advantages

Variable contact force: quickly adjusted according to test requirements, suitable for spot testing of grains of different sizes.

High-precision spot measurement: Provides stable and consistent performance in spot measurement of tiny electrodes.

Easy maintenance: Simple structure design, easy to replace and repair.

3.2 Application Prospects

Automated testing system: improve production efficiency and reduce labor costs.

Modular design: flexible configuration to meet different wafer sizes and process requirements.

Reduce test loss: Precisely control the probe contact force to reduce wafer damage during the test process.

4. Future potential of edge sensor probe holder

As chip manufacturing technology develops towards higher density and smaller size, the Edge Sensor probe seat combined with die spot measurement and Probe technology will be an indispensable core technology for future semiconductor processes. Its superior accuracy, adjustability and high maintainability will effectively improve wafer inspection efficiency and reduce manufacturing costs.

Conclusion The Edge Sensor probe holder is the next generation solution for the semiconductor manufacturing industry, especially suitable for die spotting and high-precision probe test applications. It can not only improve detection efficiency and reduce production costs, but also ensure the consistency of test results. In the future, it will play a greater role in the fields of high-frequency testing and fully automated testing.