In the semiconductor industry, AOI (automatic optical inspection) technology has become a key tool for wafer appearance defect detection. As chip size decreases and integration increases, the demand for detecting tiny defects in the production process is increasing. With high-resolution optical lenses and advanced image processing technology, AOI is now able to detect micron-level defects, which can not only improve the reliability and performance of chips, but also significantly reduce the defective rate and cost in production.

Modern AOI equipment already supports a variety of packaging forms and sizes, using 2D+3D algorithms to achieve high-precision inspection in a large field of view. AOI can not only perform all-round 6-sided inspection, but also has made significant progress in shadow-free 3D measurement and defect classification. Some companies use 4-projection system technology to reconstruct multi-angle stereo images and successfully solve the shadow problem during the inspection process. In addition, the AI-powered intelligent defect classification algorithm performs high-precision color detection for discoloration, copper exposure and other phenomena, and enables cross-machine sharing through a modular algorithm library.

These technological breakthroughs help improve the quality and efficiency of chip manufacturing and become an indispensable development trend of AOI in the field of semiconductor inspection.