AOI (Automated Optical Inspection) Technology: A Key Enabler in Semiconductor Defect Detection

In the semiconductor industry, AOI (Automated Optical Inspection) technology has become a critical tool for detecting surface defects on chips. As chip sizes continue to shrink and integration density increases, the need for identifying microscopic defects during the production process has grown significantly. With high-resolution optical lenses and advanced image processing technology, modern AOI systems can detect defects at the micron level. This capability not only enhances chip reliability and performance but also significantly reduces defect rates and manufacturing costs.

Today’s AOI equipment supports a wide range of package types and sizes, utilizing 2D+3D algorithms to achieve large field-of-view, high-precision inspection. AOI systems can now perform comprehensive six-sided inspections and have made substantial progress in 3D measurement and defect classification without shadow interference. Some manufacturers have adopted four-projection systems to reconstruct multi-angle 3D images, effectively solving shadow-related issues during inspection. Additionally, AI-powered smart classification algorithms enable high-precision color analysis for issues such as discoloration and exposed copper, while modular algorithm libraries allow for cross-platform deployment across different inspection machines.

These technological advancements are improving both the quality and efficiency of semiconductor manufacturing, making AOI an indispensable part of the future of chip inspection.